 |
|
 |
| Ceramic housing for IGBT |
| SIze: |
| 2“-5” |
|
| Technical |
Leak rate ：：≤1×10-9 Pam3/s
Flatness of copper surface：≤0.005mm
Parallelism between copper surfaces：≤0.03mm
Concentricity between flange and copper：≤0.5mm
Pull test：≥5KN/cm2
Temperature cycling：-65℃～200℃ 5circles
Plating thickness：2-7μ |
| Main material |
Ceramic：93.5%min AL2O3
Glaze：Color white ,T ≥14 0℃
Flange：TU1(OFHC·Cu)or Ni42Fe58 Alloy
Copper contact：TU1(OFHC·Cu)
Solder：Ag72Cu28 Alloy
Gate tube：TU1(OFHC·Cu)or Ni42Fe58 Alloy |
 |
| Type |
a
O.D.Flange |
b
O.D.Ceramic |
c
I.D.ceramic |
d
O.D.Contact |
h
Total.Height |
| BT50 |
73 |
66 |
55 |
47 |
26.5 |
| BT70 |
98.6 |
89 |
70 |
62.8 |
26 |
| BT90 |
111 |
104 |
91 |
75 |
26 |
| BT95 |
123 |
118 |
95 |
85.5 |
25 |
| BT135 |
168 |
158 |
135 |
125 |
26 |
| BT140 |
168 |
161 |
140 |
122 |
26 |
|
|
|
 |
